Chemicals Available

Table of Wet Etching Recipes

Use the ↑ ↓ Arrows in the header row to sort the entire table by material, selectivity, etchant etc. Piranha Solution section below. Etches Ti, Ni, Hf ~200nm stop-etch (same as InGaAs stop-etch removal) Al > 80% ~200nm stop-etch Al ≥80% 2017-12 2017-11 2018-02 2023 2023 Diluted with DI BHF:H2O = 1:100 2024 2023 2023 2023 2023 2023 2023 2023 2023 2023 2023 2014-12 Other Si3N4 also OK. PR etches quickly, SiO2 etches slowly. - Search online. 2017

Wet Etching References

Compound Semiconductor Etching

Guide to references on III±V semiconductor chemical etching (A.R. Clawson, 2001)

Metal Etching

Silicon etching

Etch rates for micromachining processing Etch rates for micromachining processing-part II Please add any confirmed etches from this reference to the The Master Table of Wet Etching (Include All Materials).

Organic removal

Piranha Solution

PureStrip (Transene)

Gold Plating Bench (Technic SEMCON 1000)

Standard plating recipes are described and taught during the equipment training for this tool. Electroplating first requires a Gold seed layer to be present on all surfaces to be plated. Common ways to produce this are to:

Chemi-Mechanical Polishing (CMP)

To Be Added

Mechanical Polishing (Allied)

To Be Added